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HV switches fixed on-time, high di/dt, ultra fast, MOSFET
HV switch with extremely fast turn-on rise time. True gate control (no avalanche technique) for highest reliability over a wide range of operating temperatures and load conditions. Designed for attachment on printed circuit boards (PCB).
Features:
- Very low impedance
- Very EMC tolerant
- Available with on-time options from 5 ns to 1 μs
Products
Options
Products
| Switch Model | Max. Voltage (kV) | Peak Current (A) | On-Resist. (Ω) | On-Time (ns) | Housing Dimensions (mm3 ) | Datasheet |
| HTS 30-08-UF | 3 | 80 | 2.5 | 120 | 80 x 38 x 25 |  |
| HTS 30-06-UF | 3.6 | 60 | 3.6 | 120 | 80 x 38 x 25 | |
| HTS 50-08-UF | 5 | 80 | 4 | 200 | 89 x 64 x 31 | |
| HTS 50-12-UF | 5 | 120 | 3 | 200 | 89 x 64 x 31 | |
| HTS 80-12-UF | 8 | 120 | 4.5 | 200 | 122 x 64 x 31 | |
| HTS 80-20-UF | 8 | 200 | 2.6 | 200 | 122 x 89 x 31 | |
| HTS 100-20-UF | 10 | 200 | 3.4 | 200 | 150 x 89 x 31 | |
| HTS 120-15-UF | 12 | 150 | 4.8 | 200 | 153 x 89 x 31 |
Options
| Options | Description |
| HFB | High Frequency Burst: Improved burst capability of driver by means of external buffer capacitors. Recommended if more than 10 pulses with less than 10 μs spacing are generated. |
| HFS | High Frequency Switching: External supply of auxiliary driver voltage (50-350 VDC according to type). Necessary if the specified “Maximum Operating Frequency” shall be exceeded. (2) |
| LP | Low Pass: Low pass filter at the control input. Propagation delay time will be increased by ~50 ns. Jitter + 500 ps. Improved noise immunity and less critical wiring in high speed applications. (3) |
| OT-5n | On-Time Reduction: On-Time reduced to 5 ns |
| OT-10n | On-Time Reduction: On-Time reduced to 10 ns |
| OT-20n | On-Time Reduction: On-Time reduced to 20 ns |
| OT-P | Programmable On-Time: On-Time adjustable in certain limits by means of external programming resistors. (2) |
| OT-C | Customized On-Time: On-Time according to customer’s specifications. Any value between 20 ns and 1 μs. (2) |
| MIN-PS | Minimum Pulse Spacing: Individually increased Recovery Time to ensure a minimum HV pulse spacing indepently of control pulse spacing. For safety relevant circuits. |
| ST | Stage Tapping: Connectors at the individual stages of stack in order to utilize single power semiconductors. To achieve fast rise times also at very low operating voltages (<0.01xVo). |
| LNC | Low Natural Capacitance: CN reduced by approximately 30%. To minimize capacitive power losses in applications with high switching frequency and high switching voltage.. |
| LL | Low Leakage Current: Off-state current reduced to less than 10% of the specified value. Not available in connection with the cooling fin options and for switches of the UF series. |
| ISO-25 | 25 kV Isolation: Isolation Voltage increased to 25 kVDC. Housing dimensions may change for some models. |
| ISO-40 | 40 kV Isolation: Isolation Voltage increased to 40 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
| ISO-80 | 80 kV Isolation: Isolation Voltage increased to 80 kVDC. Housing dimensions may change for some models. Only in connection with option PT-HV. |
| I-PC | Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors |
| I-FWD | Integrated Free-Wheeling Diode: Built-in parallel diode with short recovery time. In connection with inductive load only. |
| I-FWDN | Integrated Free-Wheeling Diode Network: Built-in parallel diode plus serial blocking diode with short recovery time. In connection with inductive load only. |
| SEP-C | Separate Control Unit. Control unit with LED indicators in a separate housing (dim. 79x38x17 mm). Linkage cable (<1m) with plug. Control unit with soldering pins or pigtails |
| FOI-C | Fibre Optics Input / Control: Additional optical control input to trigger the switch with a fibre-optical signal (only in combination with option SEP-C) (2) |
| FOO-F | Fibre Optics Output / Fault: Additional optical output to read-out the failure condition of the switch by means of a fibre-optical signal (only in combination with option SEP-C) (2) |
| I-PC | Integrated Part Components: Integration of small part components according to customer’s specifications (e.g. buffer capacitors |
| LS-C | LEMO socket for Control Connection. Input Z=100Ω. An assembled linkage cable (1m/3ft) with two plugs and one socket is included in supply. Improved noise immunity. (3) |
| PT-C | Pigtail for Control Connection: Flexible leads (l=75 mm) with PCB connector. This option is only relevant for switching modules with pins. Recommended for modules with options CF & GCF. |
| PIN-C | Pins for Control Connection: Gold plated pins for printed circuit board designs (special sockets available). This option is only relevant for switching modules which have pigtails as standard. |
| PT-HV | Pigtails for HV Connection: Flexible leads with cable lugs. For increased creepage. PT-HV is standard for all types with >25 kV switching voltage. Not recommended in extremely fast circuits. |
| ST-HV | Screw Terminals for HV Connection: Threaded inserts at the bottom of module (if not standard). For PCB design. Operation above 25 kV requires liquid insulation (Galden®/Oil) or potting. |
| UL94 | Flame Retardant Casting Resin: Casting resin according to UL-94-VO. Minimum order quantity required. (2) |
| FH | Flange Housing: Plastic flange housing for isolated attachment on conductive surfaces. Ideal if the switch is not intended for printed circuit boards. Option PT-HV is suggested. |
| TH | Tubular Housing: Tubular instead of rectangular housing. Adaption to specific ambient conditions or in case of difficult assembly situations. ‚ |
| FC | Flat Case: Height of standard plastic housings reduced to 19 mm or less. Not in combination with cooling options CF |
| ITC | Increased Thermal Conductivity: Special moulding process to increase the thermal conductivity of the module. Pd(max) will be increased by approx. 20-30%. (2) |
| CF | Copper Cooling Fins d = 0.5 mm: Fin height 35 mm. Nickel plated. For air cooling with forced or natural convection as well as for liquid cooling with non-conductive coolants. |
| CF-1 | Copper Cooling Fins d = 1 mm: Fin thickness 1.0 mm instead of 0.5 mm. The Max. Power Dissipation Pd(max) will be increased by ~80 %. For air or liquid cooling (e.g. Galden® or oil). |
| CF-X2 | “Copper Cooling Fins “”XL””: Fin area enlarged by factor 2. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.” |
| CF-X3 | “Copper Cooling Fins “”XXL””: Fin area enlarged by factor 3. Recommended for natural air convection. No significant cooling power improvement in connection with forced air or liquid cooling.” |
| CF-CS | Copper Cooling Fins with customized shape: Individual shape to meet specific OEM requirements. (2) Can be combined with options CF-1 |
| CF-LC | Copper Cooling Fins for liquid cooling: Double fins |
| CF-D | Double Copper Cooling Fins: Approx. 100% more cooling power |
| CF-S | Copper Cooling Fins: Semiconductors soldered on fins. Approx. 30% to 100% more cooling power (type depending). Combinable with options CF-D |
| CF-GRA | Non-isolated Cooling Fins made of graphite: Very light weight compared to copper at similar heat transfer |
| CF-CER | Isolated Cooling Fins made of ceramics: Heat transfer properties similar to alumina. Forced convection recommended due to 2 mm spacing between fins. Height 35 mm. |
| CCS | Ceramic Cooling Surface: Top side of switching module made of ceramics. Heat transfer properties similar to alumina. Max. 20 kVDC isolation. Forced convection recommended. |
| CCF | Ceramic Cooling Flange: Bottom side of switching module made of a plano grinded ceramic plate. Integrated metal frame for uniform and safe contact pressure. Max. 40 kVDC isolation. |
| C-DR | Cooling for Driver: Extra cooling for the driver and control electronics. Recommended in combination with option HFS at higher switching frequencies. (2) |
| GCF | Grounded Cooling Flange: Nickel-plated copper flange for High Power applications. Max. isolation voltage 40kV. Increased coupling capacitance Cc. |
| GCF-X2 | Grounded Cooling Flange |
| ILC | Indirect Liquid Cooling: Liquid cooling for all kind of conductive coolants including mains water. Internal heat exchanger made of ceramics. For medium power applications. |
| DLC | Direct Liquid Cooling: Internal cooling channels arround the power semiconductors. The most efficient cooling solution especally for high frequency applications. For non-conductive coolants only. |
| HI-REL | High Reliability / MIL Versions: Available on request. (2) |
| [1] | New option code: Data sheets may differ from this coding system (especially older ones) and do not indicate all possible options as per above table. |
| [2] | Please consult factory for detailed information. |
| [3] | These options are EMC-relevant and are recommended for industrial power applications |